Interconnection


High-density SMT headers

15 May 2013 Interconnection

Molex’s robust family of high-density 1,27 mm wire-to-board Picoflex headers and connectors, now with reverse PCB footprint SMT headers, offers space-saving solutions for a greater range of compact power and signal ribbon-cable applications.

Picoflex headers and connectors provide high retention forces in a diverse range of applications including solar, weighing systems, vehicle infotainment, computer peripherals, telecommunications and portable heart-rate monitors.

Available with and without latches and in optional high-temperature plastic, the new headers provide customers with a wider range of application opportunities without the need for costly PCB redesign.

In addition to Tin (Sn) plated contacts, Molex offers Picoflex connectors and headers plated with Palladium Nickel (PdNi) plus a Gold (Au) flash. Palladium Nickel is a durable, technologically advanced plating material with excellent wear-resistance properties, resistance to corrosion and is non-oxidising. A flash of Gold over the Palladium provides lubrication and surface wear resistance.

In today’s economic climate, PdNi-plated connectors are being widely adopted as a replacement for pure Gold-plated versions owing to the superior deposit characteristics of PdNi over Gold and lower, more stable raw material costs.

For more information contact Electrocomp, +27 (0)11 458 9000, [email protected], www.electrocomp.co.za



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