SMT headers for high volume needs

15 August 2001 Interconnection

Molex offers a cost-effective solution for high volume needs and additional design flexibility with the Mini-Fit IDT and its new surface-mount (SMT) headers. The product's SMT headers minimise PCB preparation and enhance versatility for placement on either side of the PCB. Terminating is completed using insulation displacement technology (IDT) rather than crimp, lowering applied costs by avoiding stripping and crimping.

Available in two and 12 circuit sizes, the product is a single row system consisting of both vertical and right-angle headers, plugs and receptacle for wire-to-board configurations as well as wire-to-wire. A positive latching system and moulded-in eagles for strain relief offer increased support for wires.

The product can accommodate 18, 20, 22 and 24 AWG, handle up to 7 A depending upon the circuit size and wire gauge used and is available in tin, 15 and 30 Au plating. Multiple wire gauges may be used within a single housing offering designers the functionality of power and signal with one connector. In turn, it may eliminate the need for separate connectors and harness assemblies for each required wire gauge.

Avnet Kopp

(011) 444 2333

[email protected]

www.avnet.co.za

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