Several protocols are emerging globally for outdoor and indoor smart energy networks that require robust communication and low power consumption. The Kinetis KW01 wireless MCU meets their requirements with a high-performance radio capable of up to 600 Kbps using complex modulation schemes (GFSK, MSK, GMSK and OOK) while operating at multiple frequencies in the range of 290 to 1020 MHz, supporting ISM bands in numerous global regions. Additionally, the onboard, low-power CPU system is used to handle numerous network protocols.
For outdoor applications, such as neighbourhood area networks that connect many smart meters to a common data collection point and metropolitan area networks that connect numerous street lamps or sensors, the device can support proprietary protocols and the industry-standard IEEE® 802.15.4e/g protocol.
For indoor applications connecting wireless sensors, controls, displays, appliances and machinery, the MCU can support proprietary protocols or standard protocols such as 6LoWPAN, WMBUS (EN13757-4), KNX and ECHONET.
The Kinetis KW01 is based on an ARM CortexTM-M0+ processor running up to 48 MHz with 128 KB Flash memory and 16 KB SRAM capable of consuming as little as 40 μA/MHz in typical conditions.
The system and peripherals are designed to achieve 1,7 μA device standby current with a fast wake-up time of just 4,3 microseconds, and a device stop current less than 100 nA, which includes radio configuration data retention. These features help maximise battery life in portable systems.
The IC may be used as a comprehensive modem running low-level wireless protocol layers while delegating the upper network protocol layers to run in an external host application processor.
The KW01 can also operate without a host for simpler network protocols taking advantage of its on-chip peripherals, such as the 16-bit analog-to-digital converter to implement a single-chip solution for wireless sensor networking applications.
KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...SoC for real-time AI at the edge Future Electronics
DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
Read more...Evaluation kit for ML applications Future Electronics
DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
printer friendly version