Samtec’s newest SEARAY interconnect system offers high-speed performance and the grounding and routing flexibility of its popular 1,27 x 1,27 mm open pin field SEARAY, but with a 0,8 mm micro pitch design that requires 50% less board space. This high-density system is available in 4- and 6-row designs with up to 180 I/Os (pin counts to 300 I/Os are in design).
SEARAY micro pitch terminals and sockets (SEAM8/SEAF8 series) feature Samtec’s patented Edge Rate contact system, designed for high signal integrity in rugged and high-cycle applications. The contact design also lowers insertion and extraction forces, an important consideration for high pin-count arrays.
The new 0,8 mm system comes with a standard choice of 7 mm and 10 mm stack heights and lead-free solder charge terminations.
SEARAY interconnects use solder charge technology to simplify IR reflow termination and improve solder joint reliability This reduces exposure to extreme heat, which is especially relevant with the higher temperature required for lead-free processing.
The new interconnect family includes 1,27 x 1,27 mm grid array systems with up to 500 I/Os. They are available with stack heights from 7 to 17,5 mm, right angle designs for high-speed micro backplane applications, and a press-fit design which eliminates processing concerns for BGA-style connectors.
SEARAY -LP is a low-profile, high-density arrow with stack heights as low as 4 mm. Mating high-speed coax cable assemblies, high-density riser systems up to 40 mm, and 85 Ω stackers are also available.
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