Interconnection


Edge card sockets

5 September 2012 Interconnection

Samtec has expanded its line of high-speed edge card solutions with 2,00 mm pitch Mini Edge Card Sockets for high-speed computing and storage applications as well as other complex systems with greater levels of interconnectivity. This socket is a flexible solution for use with various mating card thicknesses and comes with a choice of rugged features.

The MEC2 series is a dual-row system that is polarised for board orientation. The system is available with five to 50 stamped centres per row for up to 98 total I/Os. The socket accommodates both 1,60 mm and 2,36 mm card thicknesses and offers a current carrying capacity range up to 3,5 A per contact at 30°C temperature rise (dependent upon total number of contacts powered).

Rugged features include optional weld tabs and standard alignment pins for increased stability.





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