News


Data exchange standard on pack and packing materials

8 August 2012 News

IPC has released IPC-1758: ‘Declaration Requirements for Shipping, Pack and Packing Materials.’ This standard establishes the requirements for the exchange of information on the materials used to protect products during shipment between supply chain partners.

IPC-1758 is one of several in a series of IPC-175x data exchange standards that permit segmentation of declaration details based on the subject and scope of the declaration. In addition to describing essential information exchange content with respect to packing, it is supplemented with references to regulations impacting materials, marking, recycling information and recycled content that may be desired to complete the data package.

While IPC-1758 contains generic information regarding packing declaration, when it is used in combination with the latest version of the IPC-1751 sectional standard, the resulting document set defines the declaration information. IPC-1758 pertains to both hard copy and electronic data descriptions.

Because this standard allows for the creation of a record between suppliers and their customers, the data that is communicated may be used to help support and demonstrate due diligence.

For more information contact Nkoka Training, +27 (0)12 653 2629, [email protected], www.nkoka.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

SACEEC celebrates standout industrial innovation on the KITE 2025 show floor
News
Exhibitor innovation took the spotlight at the KITE 2025 as the South African Capital Equipment Export Council announced the winners of its prestigious New Product & Innovation Awards.

Read more...
SA team for International Olympiad in Informatics
News
The Institute of Information Technology Professionals South Africa has named the team that will represent South Africa at this year’s International Olympiad in Informatics.

Read more...
Anritsu and Bluetest to support OTA measurement
News
Anritsu Company and Sweden-based Bluetest AB have jointly developed an Over-The-Air measurement solution to evaluate the performance of 5G IoT devices compliant with the RedCap specification.

Read more...
The current sentiment of the global electronics manufacturing supply chain
News
In its latest report, the Global Electronics Association provides an analysis of the current sentiment and conditions in the global electronics manufacturing supply chain as of June 2025.

Read more...
Global semiconductor sales increase in May
News
The Semiconductor Industry Association recently announced global semiconductor sales were $59,0 billion during the month of May 2025, an increase of 19,8%.

Read more...
New president for Avnet EMEA
News
Avnet has announced that Avnet Silica’s president, Gilles Beltran, will step into the role of president of Avnet EMEA.

Read more...
DARPA sets new record for wireless power beaming
News
In tests performed in New Mexico, the Persistent Optical Wireless Energy Relay program team recorded over 800 W of power delivered for about 30 seconds with a laser beam crossing 8,6 kilometres.

Read more...
Nordic Semiconductor acquires Memfault
RF Design News
With this acquisition, Nordic has launched its first complete chip-to-cloud platform for lifecycle management of connected products.

Read more...
Trina storage demonstrates high efficiency and long-term reliability
News
Independent testing confirms 95,2% DC efficiency and 98% capacity retention after one year of operation.

Read more...
From the editor's desk: AI – a double-edged sword
Technews Publishing News
As with any powerful tool, AI presents challenges, some of which, if not carefully managed, threaten to undo the potential that it can offer.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved