27 June 2012Manufacturing / Production Technology, Hardware & Services
At the recent IEEE International Microwave Symposium, Rogers Corporation dèbuted the 2929 bondply system and low-loss RO4835 circuit laminate with enhanced oxidation resistance for long-term performance.
The 2929 bondply is an unreinforced hydrocarbon-based, thin-film adhesive system intended for use in high-performance, high-reliability, multi-layer circuit constructions. Its low dielectric constant (2,9) and low loss tangent (<0,003) at microwave frequencies make it ideal for bonding multi-layer circuit boards based on high-performance composite dielectric materials such as Rogers RT/duroid 6000, RO4000 and RO3000 series laminates.
The proprietary crosslinkable resin system makes this thin-film adhesive system compatible with sequential bond processing. The ability to manage flow of the adhesive system allows for significant blind via fill capability with potentially predictable cutback ratios for designs requiring blind cavities.
2929 bondply material is compatible with traditional flat press and autoclave bonding methods. It is currently available in 0,038, 0,051 and 0,076 mm sheet thicknesses; sheets can be stacked to yield thicker adhesive layers. The unreinforced thin-film can be tack bonded to inner layers to simplify simultaneous machining of cutouts through core and adhesive layers. A carrier film protects the adhesive layer from contamination during machining and multi-layer-board booking processes.
The new RO4835 high-frequency laminate is specially formulated with improved oxidation resistance, and was developed for applications needing a special level of electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. It offers a dielectric constant of 3,48 at 10 GHz and low loss tangent of 0,0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions.
These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper, for excellent dimensional stability. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard methods.
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