Well known for its microcontroller offering, Renesas Electronics also manufactures an extensive lineup of memory products to meet the diverse functional requirements of its customers, covering not only low-power SRAM, but also QDRII, QDRII+, DDRII & DDRII+ high-speed SRAM and a wide range of serial/parallel EEPROM. The company’s offering of low-power SRAM ranges from 256 Kbit up to 64 Mbit densities in the same package.
Renesas’ in-house Core Advanced Technology, based on unique TFT and capacitor stacked technology, delivers high reliability, small die size, and latch-up free and soft-error free results.
Many SRAM competitors make use of a 90 nm, full CMOS memory cell process. A full CMOS cell uses six transistors per memory cell, and data is stored by a small capacitor. The charge in the small capacitor can easily and unintentionally be influenced by alpha particles which can lead to incorrect storage content. The memory cell is built from P-channel and N-channel MOSFETs and due to the narrow distance of P and N channels, the latch-up phenomenon can occur.
Renesas, however, makes use of a 150 nm, TFT plus capacitor memory cell process. The advanced cell, with separate capacitors on top of the transistors, stores a significantly larger amount of charge. This solution leads to high robustness against alpha particles and results in a very low soft error rate. The memory cell is built from stacked thin-film P- and N-channel MOSFETs, which avoids latch-up.
According to Renesas, the soft error rate of its 16 Mbit SRAM has been tested and confirmed to be less than 49 FIT/device (failures in time) compared to competitors’ technology at 9382 FIT/ device.
QuecPython live demonstration Quectel Wireless Solutions
DSP, Micros & Memory
QuecPython allows designers to adapt Quectel’s modules quickly, with a low-code approach to suit their precise requirements in less time and at reduced cost, while maintaining high security standards.
Read more...Robust and customisable SBC Altron Arrow
DSP, Micros & Memory
Pairing the powerful i.MX8M Plus System on Module (SoM) from SolidRun, which features the i.MX 8M Plus SoC from NXP, this high-performance SBC is set to transform industrial environments.
Read more...New family supports future cryptography Altron Arrow
DSP, Micros & Memory
NXP has introduced its new i.MX 94 family, which contains an i.MX MPU with an integrated time-sensitive networking (TSN) switch, enabling configurable, secure communications with rich protocol support in industrial and automotive environments.
Read more...Fast and reliable 4G connectivity worldwide TRX Electronics
DSP, Micros & Memory
Powered by a powerful Quectel LTE Cat 4 modem, the Arduino Pro 4G module’s fast data throughput and high bandwidths ensure reliable and quick data download and upload, even in remote locations.
Read more...NXP’s all-purpose microcontroller series Altron Arrow
DSP, Micros & Memory
NXP has released its MCX A14x and A15x series of all-purpose microcontrollers which are part of the larger MCX portfolio that shares a common Arm Cortex-M33 core platform.
Read more...ESP32-P4 SoC iCorp Technologies
DSP, Micros & Memory
Espressif Systems announced its latest SoC, the ESP32-P4 which is powered by a RISC-V CPU, with an AI instructions extension, an advanced memory subsystem, and integrated high-speed peripherals.
Read more...Microchip SoC FPGA ASIC Design Services
DSP, Micros & Memory
Microchip Technology introduced the RT PolarFire SoC FPGA, the first real-time Linux capable, RISC-V-based microprocessor subsystem on a proven RT PolarFire FPGA platform.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Low noise 3-axis MEMS accelerometers Altron Arrow
DSP, Micros & Memory
The ADXL357 and ADXL357B from Analog Devices are digital outputs, low noise density, low 0 g offset drift, low power, three-axis accelerometers with selectable measurement ranges.
Read more...ST’s biosensing tech enables next-gen wearables Future Electronics
DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
printer friendly version