Passive Components


Tiny high-Q MLCC

7 March 2012 Passive Components

Murata today announced the GJM02 series of monolithic ceramic chip capacitors (MLCC) specifically designed for use in high-frequency module applications such as for coupling in power amplifiers. Believed to be the world’s first 01005 size (EIA) high-Q type MLCC, this miniature capacitor measures just 0,4 x 0,2 mm and has both high ‘Q’ and low equivalent series resistance (ESR) characteristics. Having a high Q value and low ESR is essential for use in VHF, UHF and microwave power amplifiers. Together they contribute to improving power amplifier efficiency and lowering power consumption.

The GJM02 is supplied in the new W4PI tape packaging style. Using a 4 mm wide embossed plastic tape with a 1 mm component pitch, this packaging removes the difficulties associated with using conventional paper tape that can deposit paper dust. Also, product pick-up errors caused by static electricity and component damage due to ESD have been minimised.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...
First 100 µF MLCC in 0603 packaging
RS South Africa Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.

Read more...