Passive Components


RF capacitors

14 September 2011 Passive Components

TDK-EPC has released the new TFSQ0402 series of thin-film capacitors in a 0402 (EIA 01005) package. Under the product name Z-match, the new capacitors are designed for power amplifier circuits and RF matching circuits in smartphones, mobile phones, wireless LANs and other communication technologies.

In order to create the new line of high-frequency components with low ESL and ESR, TDK-EPC applied TDK’s advanced thin-film technology used to manufacture HDD magnetic heads. Consequently, the capacitors achieve a tight tolerance of ±0,05 pF and high Q factor. Furthermore, the new components offer an excellent high self-resonant frequency (SRF) of 6,8 GHz (2,2 pF). With these features, the new series exhibits desirable high-frequency characteristics in impedance matching circuits.

The terminations of the Z-match series are located on the bottom surface of the components, and a very exact dicing process ensures that the component dimensions are very precise, thus making them especially suitable for mounting on modules. The components have an operating temperature range of -55°C to +125°C and are designed for use at high frequencies from 2,4 to 6 GHz.



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