Passive Components


MLCCs immune to PCB flexure

14 September 2011 Passive Components

Murata has developed a series of multilayer ceramic capacitors (MLCC) with a unique external metal terminal design which reduces problems associated with mounting larger size MLCCs, including acoustic noise production and cracks caused by flexing the PCB. The construction of the KRM series also allows two capacitors to be mounted on top of each other, doubling the effective capacitance to achieve very high capacitance values inside small footprints. Additionally, these parts perform very well in heat shock cycle tests.

With a traditionally mounted capacitor, when a PCB is subject to bending forces, this causes mechanical stress in the capacitor and solder joints, which leads to cracking. Also, when subject to AC voltages, ceramic capacitors can change their shape and exert a cyclic bending force on the PCB which causes acoustic noise. The new KRM series features ferric alloy terminals which lift the body of the capacitor up to 1 mm above the surface of the PCB when mounted, helping ensure that bending forces are not transmitted between the PCB and the capacitor and vice versa, avoiding the problems described above.

In tests, a KRM series capacitor was mounted on a PCB and subjected to 20 V d.c., 1 Vpp a.c.. It produced 20 dB of acoustic noise compared to the 55 dB produced by an identical MLCC that did not have the metal terminals and was mounted directly onto the PCB. The KRM series capacitor was also subjected to up to 6 mm of PCB flexure without any cracks appearing, while the traditional MLCC had cracked before 3 mm of flexure was reached. In heat shock cycle tests, the KRM series again outperformed the traditional MLCCs after 2000 cycles of -55/+125°C, 5 minutes, with no visible cracking or deformation of the capacitor or the solder joints.

The KRM lineup extends from the KRM55WR71E476MH01K, a 47 μF part measuring 6,1 x 5,3 x 6,4 mm and rated at 25 V, to the KRM55TR72A106MH01K, a 10 μF part rated at 100 V which measures 6,1 x 5,3 x 4,8 mm.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...
First 100 µF MLCC in 0603 packaging
RS South Africa Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.

Read more...