Texas Instruments has premiered its first module platform housing the WiLink 6.0 (WL1271) single-chip, wireless combo solution with TI’s open source, Linux-based OpenLink drivers. The OpenLink drivers are built on the community-validated mac80211 Wi-Fi driver and BlueZ Bluetooth protocol stack.
The first in a series of such open source platforms from TI, the new WiLink 6.0 OpenLink platform is pre-integrated with TI’s AM18x Sitara ARM microprocessors (MPUs). This enables customers developing industrial or point-of-service applications on cost-effective ARM MPUs to easily introduce reliable, low-power Wi-Fi and Bluetooth wireless technologies. As a result, products built on Sitara ARM MPUs can serve as a mobile Wi-Fi gateway or support peer-to-peer file transfers with other Wi-Fi enabled devices. These capabilities eliminate the need for external access points and create opportunities for unique use cases depending on mobile, self-networking devices.
The AM18x Sitara ARM EVM + WL1271 development kit is the latest version of TI’s original AM18x Sitara ARM EVM and includes elements that create a quick-start experience right out of the box.
Module combines 5G and NTN support Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions announced the launch of its BG770A-SN ultra-compact 5G-ready satellite communication module, compliant with 3GPP releases 13, 14 and 17.
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Telecoms, Datacoms, Wireless, IoT
EasyPass is an enhancement within Cambium’s cnMaestro platform, aimed at providing local businesses with secure, efficient, and scalable device management, making it ideal for high-demand environments such as educational institutions, retail spaces, and corporate campuses.
Read more...SIMCom’s A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom’s A7673X series is a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
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AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
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Fibocom unveiled its MA510-GL (NTN), a non-terrestrial networks module which is compliant with 3GPP Release 17 standard.
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DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Cellular IoT connectivity via satellite Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Telit Cinterion cellular LPWA module will enable satellite data communication using the NB-IoT protocol, without any special hardware changes required for the integration of the cellular module in the customer application.
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Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...Wireless module supports up to 600 Mbps iCorp Technologies
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Quectel’s FCU865R is a high-performance Wi-Fi 6 and Bluetooth 5.3 LCC package module which can be used for WLAN and Bluetooth connections.
Read more...Unlocking the future of connectivity
Telecoms, Datacoms, Wireless, IoT
The battle for the 6 GHz spectrum band is heating up in South Africa, mirroring global debates on the allocation of spectrum between Wi-Fi and cellular operators.
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