Winbond Electronics has introduced the latest offering of its mobile LPSDRAM products. With 65 nm ‘buried world line’ technology, there are four new devices of 512 Mb mobile LPSDRAM which extend the memory’s application beyond the mobile phone field to areas of mobile consumer electronics and mobile communication.
The W989D6C and W989D2C are 512 Mb devices which support x16/x32 data width. Major features include sequential or interleave burst;166 MHz clock rate; standard self refresh; partial-array self refresh (PASR); automatic temperature compensated self refresh rate (ATCSR); deep power-down (DPD); and programmable output buffer driver strength.
The W949D6C and W949D2C boast similar features, and add double data rate and a 200 MHz clock rate.
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