Vishay expanded its TMBS Trench MOS Barrier Schottky rectifiers for solar bypass applications with four new 45 V devices offering eSMP surface-mount and axial-leaded package options.
The devices are designed to enable higher current densities in low-voltage, high-frequency inverters and solar cell junction boxes, where they can be used as bypass diodes for photovoltaic solar cell protection. The 10 A V10P45S and 15 A V15P45S are offered in surface-mount SMPC packages with a typical height of 1,1 mm. Designed for automated placement, the SMPC package meets MSL Level 1. New axial-leaded rectifiers include the 15 A VSB1545 and 20 A VSB2045 in the P600 package. The devices can handle solder dip temperatures to 275°C for 10 seconds per JESD 22-B106, and feature a maximum junction temperature of +150°C.
The TMBS rectifiers combine their high forward surge capability with low forward voltage drops down to 0,30 V to minimise power losses. The devices are compliant to RoHS Directive 2002/95/EC and WEEE 2002/96/EC, and are halogen-free according to the IEC 61249-2-21 definition.
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