Samtec has expanded its line of high-speed edge card solutions to include a new high-density socket featuring a bi-level mating design and two levels of contacts on a staggered 1 mm centreline, which creates an effective 0,5 mm pitch. The resulting system is not only high-density, but also saves PCB real estate.
The Edge Rate BEC5 series is available with up to 140 I/Os in a 1,00 x 1,27 mm grid PCB pad layout (four rows of contacts). This system is designed for high-speed applications that can benefit from its rugged Edge Rate contacts which are designed for superior impedance control and reduced broadside coupling with increased durability and cycle life.
The 0,5 mm pitch socket accepts standard 1,60 mm and 2,40 mm thick cards. Additional features include weld tabs, alignment pins and lead-free solder charge terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.
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