GradConn introduced a space-saving Micro SIM connector for 3FF SIM cards.
The CH03-FA connector accepts the Micro SIM card, which is also known as Mini UICC or 3FF (3rd form factor). This new form factor is creating a buzz in the market after being included in high profile Apple consumer products.
Micro SIM cards have the same thickness and contact arrangement as a standard SIM card, however the reduced card size of 12 x 15 mm shows significant savings in both PCB and card footprints. With six or eight contacts and a profile height of just 2,6 mm, the CH03-FA is available in tape and reel packaging, withstands IR reflow temperatures and is fully RoHS compliant.
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Interconnection
The mBend cable assemblies from Anoison are designed to meet the growing demand for low-profile coaxial connections in applications where space is limited, and precise bending is necessary right next to the connectors.
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Interconnection
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Interconnection
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