Telecoms, Datacoms, Wireless, IoT


Multilayer ceramic chip antennas

19 January 2011 Telecoms, Datacoms, Wireless, IoT

Vishay released high-performance multilayer ceramic chip antennas for mobile devices to cover the entire UHF band from 470 MHz to 860 MHz. Utilising Vishay’s materials and manufacturing technologies, the new Vitramon chip antennas comply with the MBRAI standard while maintaining small outlines of 35 by 5 by 1,2 mm for the VJ 3505, and 10,5 by 15,5 by 1,2 mm for the VJ 6040.

The antennas are designed for mobile UHF TV receivers, including DVB-T, DVB-H, ISDB-T and MediaFLO devices, where they eliminate the need for large external antennas. They feature a 50 Ω unbalanced interface and operating temperature range of - 40°C to + 85°C. The RoHS-compliant devices are omnidirectional with linear polarisation, and are designed to be assembled onto a PC board in the standard reflow process. Reference designs and evaluation boards are available upon request.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Module combines 5G and NTN support
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions announced the launch of its BG770A-SN ultra-compact 5G-ready satellite communication module, compliant with 3GPP releases 13, 14 and 17.

Read more...
Scalable and secure IoT device onboarding and management
Telecoms, Datacoms, Wireless, IoT
EasyPass is an enhancement within Cambium’s cnMaestro platform, aimed at providing local businesses with secure, efficient, and scalable device management, making it ideal for high-demand environments such as educational institutions, retail spaces, and corporate campuses.

Read more...
SIMCom’s A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom’s A7673X series is a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...
Non-terrestrial network module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Fibocom unveiled its MA510-GL (NTN), a non-terrestrial networks module which is compliant with 3GPP Release 17 standard.

Read more...
Cellular IoT connectivity via satellite
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The Telit Cinterion cellular LPWA module will enable satellite data communication using the NB-IoT protocol, without any special hardware changes required for the integration of the cellular module in the customer application.

Read more...
Wireless module supports up to 600 Mbps
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s FCU865R is a high-performance Wi-Fi 6 and Bluetooth 5.3 LCC package module which can be used for WLAN and Bluetooth connections.

Read more...
ST’s biosensing tech enables next-gen wearables
Future Electronics DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.

Read more...
Unlocking the future of connectivity
Telecoms, Datacoms, Wireless, IoT
The battle for the 6 GHz spectrum band is heating up in South Africa, mirroring global debates on the allocation of spectrum between Wi-Fi and cellular operators.

Read more...
Quectel wireless module wins accolade
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The winners of the 2024 IoT Evolution 5G Leadership Award were recently announced, with Quectel walking away with an award for its modules which make 5G features more easily accessible for IoT applications, notably the company’s RG255C-GL.

Read more...
1700 V GaN Switcher IC
Future Electronics Power Electronics / Power Management
Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.

Read more...