Interconnection


High-density D-Sub connectors

4 August 2010 Interconnection

FCI has expanded its D-sub high density series to address a growing number of applications where higher density packaging is required. The range previously consisted of right-angle female versions only. The additional range adds right-angle male, straight male and female, solder bucket male and female, and crimp male and female versions. These higher density connectors with same shell sizes provide 56% to 67% real estate savings on a printed circuit board compared with standard density connectors.

The high density D-sub series is available in contact layouts from 15 to 78 ways in all terminations. These connectors are operable for indoor applications with a temperature range from - 55°C to +105°C.



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