Vishay has announced a new series of ceramic LED submounts designed to provide thermal management for high-power (>1 W) LED devices. The LSUB series offers low thermal resistance down to 3 K/W. Optimised for high-power LEDs and laser diodes in automotive, industrial and home applications, LSUB devices are designed to minimise the thermal resistance between the die and the package termination. The LSUB’s enhanced thermal design enables a lower junction temperature and increased efficiency and reliability.
The LSUB series is available in two configurations: a standard configuration designed for conductive epoxy or thick solder (greater than 12 μm) die attach methods, and an offset configuration designed for thin solder layers in the 2 μm to 3 μm range. The LSUB is designed to accommodate high-power LED dice that are approximately 1 by 1 mm. The pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
The package bases are offered as singulated individual die or in square arrays. Additional LED configurations and form factors are available upon request. The LSUB is offered packaged in waffle packs or in wafer form for automatic die assembly.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...Advanced HMI delivers enhanced durability Fox Controls Rand
Opto-Electronics
This compact touchscreen HMI from IDEC provides essential visualisation and high-performance multitouch control, even in the most space-limited applications.
Read more...Powerful UVC disinfection
Opto-Electronics
The S3535-H emitter generates an output power of more than 150 mW per chip at 265 nm, providing the strongest germicidal effect currently available on the market.
Read more...Front panels for electronics Seven Labs Technology
Opto-Electronics
In the world of electronics, the significance of a well-designed front panel cannot be overstated as it serves not only as the first point of interaction between users and devices, but also plays a crucial role in the functionality and aesthetics of electronic products.
Read more...Cree: Illuminating the future of LED technology Altron Arrow
Editor's Choice Opto-Electronics
As a pioneer in this field, Cree LED has been instrumental in shaping the LED landscape, driving innovation and performance in this sector.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
printer friendly version