Logic Devices’ IMOD family of DDR memory products is based on integration of multiple silicon devices, manufactured on an organic laminate substrate and encapsulated with industry standard plastic encapsulating materials providing suitability of use in industrial, extended and Mil-temp applications.
The thermally enhanced IMOD package adds, via packaging IP, a method for improving the thermal conductivity by providing a low resistance thermal path to the package topside, in addition to the thermal properties normally associated with BGA packaging. This packaging technology promotes excellent thermal relief via the bottom side interface, as well as adding an improved thermal path via the topside package surface.
The IMOD family is available in a range of sizes and packages, from 1 GB DDR1 memory with a data transfer rate of 333 MHz to 4,5 GB DDR3 memory with a data transfer rate of 1333 MHz.
QuecPython live demonstration Quectel Wireless Solutions
DSP, Micros & Memory
QuecPython allows designers to adapt Quectel’s modules quickly, with a low-code approach to suit their precise requirements in less time and at reduced cost, while maintaining high security standards.
Read more...Robust and customisable SBC Altron Arrow
DSP, Micros & Memory
Pairing the powerful i.MX8M Plus System on Module (SoM) from SolidRun, which features the i.MX 8M Plus SoC from NXP, this high-performance SBC is set to transform industrial environments.
Read more...New family supports future cryptography Altron Arrow
DSP, Micros & Memory
NXP has introduced its new i.MX 94 family, which contains an i.MX MPU with an integrated time-sensitive networking (TSN) switch, enabling configurable, secure communications with rich protocol support in industrial and automotive environments.
Read more...Fast and reliable 4G connectivity worldwide TRX Electronics
DSP, Micros & Memory
Powered by a powerful Quectel LTE Cat 4 modem, the Arduino Pro 4G module’s fast data throughput and high bandwidths ensure reliable and quick data download and upload, even in remote locations.
Read more...NXP’s all-purpose microcontroller series Altron Arrow
DSP, Micros & Memory
NXP has released its MCX A14x and A15x series of all-purpose microcontrollers which are part of the larger MCX portfolio that shares a common Arm Cortex-M33 core platform.
Read more...ESP32-P4 SoC iCorp Technologies
DSP, Micros & Memory
Espressif Systems announced its latest SoC, the ESP32-P4 which is powered by a RISC-V CPU, with an AI instructions extension, an advanced memory subsystem, and integrated high-speed peripherals.
Read more...Microchip SoC FPGA ASIC Design Services
DSP, Micros & Memory
Microchip Technology introduced the RT PolarFire SoC FPGA, the first real-time Linux capable, RISC-V-based microprocessor subsystem on a proven RT PolarFire FPGA platform.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Low noise 3-axis MEMS accelerometers Altron Arrow
DSP, Micros & Memory
The ADXL357 and ADXL357B from Analog Devices are digital outputs, low noise density, low 0 g offset drift, low power, three-axis accelerometers with selectable measurement ranges.
Read more...ST’s biosensing tech enables next-gen wearables Future Electronics
DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
printer friendly version