Harwin has broadened its range of surface mount EMI/RFI shield clips with the launch of the Maxi Clip, which handles protective cans with wall thicknesses of between 0,7 and 1 mm.
The use of clips reduces assembly time and simplifies rework. Rather than hand-soldering shielding cans to a PCB as a secondary operation, cans are simply pressed into clips which have been placed during the main automated surface mount assembly processing. Not only does this save time, it also reduces errors and scrap, and enables sensitive components to be inspected and, if necessary, lifted and replaced more easily. The new Maxi clips complement the Midi clips which handle cans with a wall thickness of 0,3 mm and its Mini series devices which save PCB space and handle cans with a wall thickness of between 0,13 and 0,23 mm.
Supplied in industry-standard tape-and-reel packaging, Harwin’s EMI/RFI clips are targeted at telecoms, datacoms, data processing and in-car entertainment systems.
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