Aries Electronics recently added new BGA Switch-A-Pitch adapters that allow for smaller pitch devices to be used with larger pitch boards. The new adapters in the series have tops with BGA landing pads on a 0,40 mm pitch and bottoms fitted with BGA balls on a 1,00 mm pitch. Open space around the adapter tops enables further components to be added to the design.
High density interconnect (HDI) construction is reduced and the need for laser-drilled microvias on the motherboard is eliminated by adapting tighter pitch devices to larger footprints. The BGA Switch-A-Pitch adapters enable the use of standard line and trace spacing down to 0,076 mm. They can operate at up to 105°C for FR4 and up to 130°C for lead-free. The recommended PCB size for a 1,00 mm pitch is 0,50 mm. Boards are 1,57 mm thick FR4 or Rogers 370 HR with 1/2 oz copper traces on both sides. Solder spheres are 63/37 tin/lead or lead-free SAC 305. The adapters feature non-solder mask defined (NSMD) pads finished with electroless nickel immersion gold (ENIG).
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