Harwin has launched its new EZ BoardWare brand, comprising surface mount products designed to improve manufacturing flexibility, reduce manufacturing costs and improve in-field maintenance.
In contrast to EMC shielding cans which are usually soldered to the board as a secondary operation after the main automated assembly process, EZ-Shield Clips can be surface mounted, allowing a shielding can to be simply pushed into place during final assembly. Also part of the new range, versatile EZ-RFI Fingers allow for a sliding or wiping contact and facilitate electrical contact between PCB and metal cases, etc, save manufacturing costs when compared to using grounding finger strips.
When it comes to cable management, EZ-Cable Clips are small and low-profile compared to equivalent plastic devices. They are placed directly onto solder pads, thus negating the need to drill retaining holes in the PCB. EZ-Jumper Links can enable designers to eliminate through-hole vias and multilayer construction. Lastly, EZ-Test Points provide technicians with easy-to-see test points and minimise the risk of PCB damage by incorrect test methods.
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Interconnection
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