ITT has enhanced its family of Universal Contacts to suit applications requiring angular alignment.
The Universal Contact for angular alignment provides a vertical electrical connection between a device and a printed circuit board, while also allowing angular mating in the same footprint as a standard Universal Contact.
The Universal Contact for angular alignment features a sloped front beam, enabling a mating angle of 90° while still retaining the same dimensions as standard Universal Contacts (2,5 mm free height, 1,0 mm deflection and X-Y-Z movement). A solder well prevents wicking of flux solder into the critical beam area, and side wings prevent beam overstress. Additional features include a domed contact for high hertz forces, minimum pre-load force of 0,3 N, contact pitch of 1,35 mm and voltage rating to 500 V d.c.
ST’s biosensing tech enables next-gen wearables Future Electronics
DSP, Micros & Memory
The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
Read more...Industrial Ethernet with HARTING solutions
Interconnection
In today’s fast-paced industrial landscape, Ethernet connectivity plays a crucial role in automation, ensuring seamless communication between machines and systems, and HARTING offers a wide range of innovative Ethernet products.
Read more...1700 V GaN Switcher IC Future Electronics
Power Electronics / Power Management
Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
Read more...Steel wire cable tray systems RS South Africa
Interconnection
Legrand has developed a zinc aluminium finish surface treatment for its Cablofil steel wire cable tray system to minimise the threat of zinc whiskers forming.
Read more...Versatile high-current contacts Spectrum Concepts
Interconnection
Mill-Max has announced the release of its number 36 contact, a unique contact designed to accept a wide range of lead sizes, while providing low insertion force and high current carrying capacity.
Read more...High-density coax assemblies RFiber Solutions
Interconnection
WithWave’s high speed and high-density multi-coax cable assemblies provide a wide range of multiple coax connectors and flexible cable assemblies, with a choice of 20, 40, 50, 67 or 110 GHz configurations.
Read more...32-bit range of MCUs Future Electronics
DSP, Micros & Memory
If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...i.MX RT700 for the AI-enabled edge Future Electronics
DSP, Micros & Memory
Designed to enable significant power savings, the highly integrated i.MX RT700 crossover MCU features NXP’s eIQ Neutron Neural Processing Unit, delivering up to 172x AI acceleration at the edge.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.