New from Radiall is an extensive range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry. The company offers four different product groups and 10 connector series including the new SMP-MAX, SMP-Spring, IMP-Spring as well as other misalignment solutions. They address demanding wireless telecom applications required for the new generation of infrastructure compact equipment such as base-stations and handheld devices.
The SMP-MAX large misalignment solution has a patented impedance matching insulator that is optimised for a larger operating gap between connectors, making it easier for engineers to handle a maximum board-to-board distance tolerance of up to 2 mm gap without a spring, which is 300% more than the standard SMP. It also features a 3° tilt (radial travel) and it has an operating frequency range of DC – 6 GHz, a 1,2 max VSWR guaranteed up to 3 GHz and it can handle up to 165 W of power at 3 GHz.
IMP-Spring, SMP-Spring and MMBX-Spring are spring-loaded solutions for both increased board-to-board distance misalignment tolerances of up to 2 mm and a tilt (radial travel) of up to 4,5°. In addition, these spring-loaded solutions have a consistent low VSWR, down to 1,15 at 3 GHz, and low RF leakage.
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