Design Automation


Design tool for multi-output power supplies

3 March 2010 Design Automation

National Semiconductor has expanded its WEBENCH Designer tools with the introduction of WEBENCH Power Architect – a design tool that allows engineers to create, model and implement multiple-output, high-performance DC-DC power supplies for an entire system.

With this tool, system designers can optimise multiple power supplies across several performance parameters including topology, intermediate voltage rails, footprint, efficiency, component count and bill of materials cost.

Power Architect supports National’s new Simple Switcher power modules. They provide highly integrated and easy-to-use solutions for power supplies requiring low parts count, small footprint, thermal resistance and low electromagnetic interference (EMI). Using WEBENCH Power Architect’s library of 21 000 components from 110 manufacturers, designers have a wide range of system alternatives for creating large scale complex systems.

When engineers finish ‘dialling-in’ their preference for footprint, system BOM cost and power efficiency, Power Architect’s graphical analysis capability identifies major sources of power dissipation, cost and footprint area. It allows the user to edit individual power supplies and loads to further model and optimise the overall system for thermal and electrical performance design goals. When the design is complete, the tool generates a system summary report including schematics, BOMs and electrical operating values. To view a video demonstration or begin a design with the WEBENCH Power Architect, go to www.national.com/powerarchitect.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Powering the intelligent edge
EBV Electrolink AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Read more...
QLC Flash memory using BiCS tech
EBV Electrolink DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.

Read more...
Integrated POL voltage regulators
EBV Electrolink Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.

Read more...
UFS Flash named Best in Show
EBV Electrolink News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.

Read more...
The power of UWB
EBV Electrolink Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.

Read more...
Trimension family secures car access
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.

Read more...
Altium provides free training
Design Automation
There is no longer any excuse not to master Altium Designer with the company now offering both advanced instructor-led three-day training and an on-demand video series.

Read more...
Entry-level MCU with classical peripherals
EBV Electrolink DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.

Read more...
Altium syncs your design and PCB programming software
EDA Technologies Design Automation
Altium Designer and Altium 365 can keep track of everything needed in PCB design, PCB programming language, component sourcing, and much more, as an embedded application is developed.

Read more...
QLC Flash memory with the latest BiCS technology
EBV Electrolink Analogue, Mixed Signal, LSI
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.

Read more...