Passive Components


New MLCC dielectrics from Kemet

3 February 2010 Passive Components

Kemet has expanded its high-temperature product portfolio with the addition of new UltraStable X8R and X8L dielectric platforms. SMD MLCCs utilising these dielectrics feature a 150°C maximum operating temperature. Product applications include harsh environments such as down-hole (oil exploration), automotive (under the hood), military and aerospace.

UltraStable X8R dielectric features a 150°C maximum operating temperature, with the same temperature capability as conventional X8R, but without the capacitance loss due to applied DC voltage. UltraStable X8R exhibits no capacitance loss and is a suitable replacement for higher capacitance and larger footprint devices that fail to offer capacitance stability. Six standard package options are available which include EIA 0402, 0603, 0805, 1206, 1210, and 1812 case sizes. Devices are available in DC voltage ratings of 25 V, 50 V and 100 V, with capacitance offerings ranging from 10 pF to 0,22 μF. Capacitance tolerance offerings include ±1%, ±2%, ±5%, ±10% and ±20%, with capacitance shift limited to ±15% from -55°C to +150°C.

X8L dielectric offers an operating temperature range from -55°C to +150°C with capacitance shift limited to ±15% from -55°C to +125°C and +15/-40% from 125°C to 150°C. Five standard package options are available which include EIA 0402, 0603, 0805, 1206 and 1210 case sizes. Devices are available in DC voltage ratings of 10 V, 25 V and 50 V, with capacitance offerings also ranging from 10 pF to 0,22 μF. Capacitance tolerance offerings include ±5%, ±10% and ±20.

Both platforms are environmentally friendly in compliance with RoHS legislation and are being offered in both commercial and automotive grades with 100% pure matte tin-plated terminations that allow for excellent solderability. Sn/Pb termination is also available upon request, with a flexible termination option becoming available in the near future.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...
First 100 µF MLCC in 0603 packaging
RS South Africa Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.

Read more...