Passive Components


Flip chip voltage divider

24 June 2009 Passive Components

Vishay has enhanced its VFCD1505 surface-mount flip chip voltage divider with a fast thermal stabilisation time of less than 1 second.

The device provides a low absolute TCR of ±0,05 ppm/°C from 0°C to +60°C and ±0,2 ppm/


°C from -55°C to +125°C, PCR tracking (change in resistance due to self heating) of ±5 ppm at rated power and a load life stability ratio of ±0,005% (50 p;ppm).

The VFCD1505 provides tight tolerance matching of ±0,01% (available down to ±0,005%) and TCR tracking of 0,1 ppm/°C between two resistors simultaneously etched on one piece of foil on a common substrate. The flip chip termination minimises the board space required, as the terminal pad is under the resistor and not out to the side, as it is with a wraparound termination. In dividers that are comprised of two resistors and three terminations, the flip chip divider has three pads under the resistor rather than four to the side.

The VFCD1505 offers high ESD immunity, withstanding electrostatic discharges up to 25 kV for increased reliability. Either side of the divider can have a resistance specified from 1 k to 10 k. Like all Vishay Foil resistors, the VFCD1505 is not restricted to standard values, and Vishay says they can be supplied with ‘as required’ values (eg, 7 k vs. 7,6543 k) at no extra cost or delivery time.

Applications for the device include high-precision instrumentation amplifiers, bridge networks, differential amplifiers and ratio arms in bridge circuits for ultra-stable and high-reliability products such as medical, test and military equipment. Screening in accordance with EEE-INST-002 is available (MIL-PRF 55342).

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



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