Interconnection


Low-profile tactile switch

18 March 2009 Interconnection

A new tactile switch from Tyco Electronics combines side actuated switch operation with a modern slim design. With a height of only 1,65 mm, the FSM3MS is suitable for miniature low-profile applications.

Offering a space saving switch solution on the PCB, the switch benefits from small dimensions of only 4,7 x 4,5 x 1,65 mm (w x d x h) and is available in two versions, with or without location pins. The version containing location pins is ideal for fixing the switch on the PCB during the soldering process.

Technical details of the FSM3MS device include a contact rating of 50 mA at 12 V d.c., a mechanical life of 100 000 operations, an actuation force of 2,2 N, a travel of 0,3 mm ± 0,1 mm and an operating temperature range of -20°C to +85°C.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

mBend cable assemblies
Conical Technologies Interconnection
The mBend cable assemblies from Anoison are designed to meet the growing demand for low-profile coaxial connections in applications where space is limited, and precise bending is necessary right next to the connectors.

Read more...
Configurable DIN rail housings
Wiltron Agencies Interconnection
With PTR HARTMANN’s INS265 design kit, DIN rail housings can be individually configured using a wide range of options.

Read more...
USB Type-C-powered controllers
Future Electronics Power Electronics / Power Management
Diodes Incorporated has released two USB Type-C PD 3.1 extended power range sink controllers that can be embedded into battery-powered devices.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
Evaluation kit for ML applications
Future Electronics DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

Read more...
Power relays for energy management applications
Future Electronics Power Electronics / Power Management
The Panasonic Industry HE-R Series is an energy management relay designed for single-phase or 3-phase AC charging units, combining high capacity, high switching, and low operating power into a small size power relay.

Read more...
Advanced eMMC storage solutions
Future Electronics DSP, Micros & Memory
Alliance Memory provides advanced NAND flash memory storage solutions that follow the JEDEC eMMC v5.1 standard to meet the growing demand for efficient, high-capacity storage solutions in today’s digital era.

Read more...
NPU in the most powerful STM32 processor
Future Electronics DSP, Micros & Memory
The STM32N6 is STMicroelectronics’ newest and most powerful STM32 and the first to come with the company’s Neural-ART Accelerator, a custom NPU capable of 600 GOPS.

Read more...
E-mobility innovation: balancing power, sensors, and connectivity
Future Electronics Manufacturing / Production Technology, Hardware & Services
The future of e-mobility is being shaped by innovations in power systems, connectivity, and sustainable design, and this article explores key technologies driving the industry forward.

Read more...
Connectors for the latest server applications
Spectrum Concepts Interconnection
To deliver high-speed performance, many next-generation server applications will use cables inside the box instead of PCB traces to maintain the signal integrity demanded by high-speed communications.

Read more...