Providing designers with a high density FPGA, Altera has announced the availability of new 8 x 8 mm packaging (M164) for its family of 65 nm Cyclone III FPGAs. Designers of space-constrained high-volume applications in consumer, military and industrial markets can now take advantage of the low power and high density of these devices.
The new 164-pin package with up to 16 K logic elements (LEs) extends Cyclone III's high-density small-package offering that includes 14 x 14 mm 256-pin (U256) and 17 x 17 mm 484-pin (U484) packages. Cyclone III devices deliver 5 K to 120 K LEs, up to 4 Mbits of memory and up to 288 digital signal processing (DSP) multipliers.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
Read more...Entry-level MCU with classical peripherals EBV Electrolink
DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
Read more...QLC Flash memory with the latest BiCS technology EBV Electrolink
Analogue, Mixed Signal, LSI
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
Read more...Webinar: Game-changing Matter standard EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
Read more...General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
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