Passive Components


Military-grade SMPS stacked capacitors

9 July 2008 Passive Components

Targeting the defence and aerospace markets, Kemet has introduced military-grade ceramic stacked capacitors for use in high-frequency power supplies. The products are commonly referred to as Switch Mode Power Supply Stacked Capacitors, or SMPS Stacked Capacitors. The product line is qualified to Military Performance Specification MIL-PRF-49470 and DSCC Drawing 87106. The capacitors are intended for high-reliability SMPS and pulse energy applications. Their low equivalent series resistance (ESR) and equivalent series inductance (ESL) make them ideally suited for input and output filtering of power supply applications as well as snubber applications.

These capacitors are now available in case codes 3, 4, and 5, X7R dielectric, voltage ratings from 50 V d.c. up to 500 V d.c., and capacitance values up to 47 μF. The chip stack is horizontal and the leadframe attachment is a high-temperature solder. They are also available in unencapsulated (unpotted bare chips) or encapsulated (potted assembly) styles. The encapsulated styles are primarily used for applications where increased mechanical and environmental protection is required, such as in avionics systems.

With an operating temperature range between -55°C and +125°C, and with capacitance shift limited to ±15% over that range, these SMPS stacked capacitors are suited to electrical applications, general purpose applications and high-frequency power supply circuits.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Tiny power inductor for low noise applications
iCorp Technologies Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.

Read more...
3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...