Advanced shielding and heat dissipation performance for board level shielding

14 March 2001 Manufacturing / Production Technology, Hardware & Services

Instrument Specialties-APM's addition to its Cool-Shield product line, the Cool-Shield II, Series 97-2018, has a unique design that provides a combination of advanced board level EMI shielding and thermal management.

This product utilises an aluminium heatsink that slides into a four-sided EMI finger stock fence, to make electrical contact and grounding of the heatsink. The heatsink (lid) and finger stock (fence) combination provides a shielding enclosure around single or multiple board level components. The latter provides a ground path for the heatsink for effective EMI shielding. A thermally conductive double-sided adhesive pad applied to the underside of the heatsink provides secure attachment and heat transfer from board level components while optional heatsink clips are also available to provide enhanced resistance to shock and vibration. System cools and extends component life; typical thermal performance of 16,5°C/W at 1 m/s air velocity, or 30°C/W for natural convection for a 25 x 25 x 10 mm heatsink. The heatsink has a removable lid over the components by providing quick and easy component maintenance.

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