Interconnection


Wire-to-board connectors save space

8 August 2007 Interconnection

Molex claims that its Pico-Clasp family is the smallest pitch connector family for positive lock wire-to-board crimp systems available.

This new 1 mm pitch wire-to-board connector system offers space-saving solutions in applications such as plasma display panel (PDP) TVs, liquid crystal display (LCD) TVs, Notebook PCs and other compact devices, where small sizes are an industry standard. Versions with an inner positive lock provide latch protection, secure mating confirmation and reliability compared to most traditional outer-lock styles. Inner positive lock versions are available in six to 50 circuits.

Versions with outer positive locks are available in three to five circuits and provide strong mating retention along with a clear audible click when all connectors are in place. Low mating and unmating forces allow for easy connector insertion and extraction. The system is offered in both single and dual row versions and friction and positive locking options are available for various application needs. In addition, the wide header variations provide customers with many choices and overall design flexibility.

Other features of the Pico-Clasp family include mating guides, solder tabs and footprint compatibility with some competitive versions.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Ryzen-based computer on module
Altron Arrow AI & ML
SolidRun announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.

Read more...
Robust and customisable SBC
Altron Arrow DSP, Micros & Memory
Pairing the powerful i.MX8M Plus System on Module (SoM) from SolidRun, which features the i.MX 8M Plus SoC from NXP, this high-performance SBC is set to transform industrial environments.

Read more...
New family supports future cryptography
Altron Arrow DSP, Micros & Memory
NXP has introduced its new i.MX 94 family, which contains an i.MX MPU with an integrated time-sensitive networking (TSN) switch, enabling configurable, secure communications with rich protocol support in industrial and automotive environments.

Read more...
NXP’s all-purpose microcontroller series
Altron Arrow DSP, Micros & Memory
NXP has released its MCX A14x and A15x series of all-purpose microcontrollers which are part of the larger MCX portfolio that shares a common Arm Cortex-M33 core platform.

Read more...
Non-terrestrial network module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Fibocom unveiled its MA510-GL (NTN), a non-terrestrial networks module which is compliant with 3GPP Release 17 standard.

Read more...
Cellular IoT connectivity via satellite
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The Telit Cinterion cellular LPWA module will enable satellite data communication using the NB-IoT protocol, without any special hardware changes required for the integration of the cellular module in the customer application.

Read more...
Low noise 3-axis MEMS accelerometers
Altron Arrow DSP, Micros & Memory
The ADXL357 and ADXL357B from Analog Devices are digital outputs, low noise density, low 0 g offset drift, low power, three-axis accelerometers with selectable measurement ranges.

Read more...
Industrial Ethernet with HARTING solutions
Interconnection
In today’s fast-paced industrial landscape, Ethernet connectivity plays a crucial role in automation, ensuring seamless communication between machines and systems, and HARTING offers a wide range of innovative Ethernet products.

Read more...
Infineon launches Edge Ai software solution
Altron Arrow Analogue, Mixed Signal, LSI
Infineon has introduced DEEPCRAFT, a new software solution category brand for Edge AI and machine learning, after the company recognised the huge potential of Edge AI for the market.

Read more...
Cree: Illuminating the future of LED technology
Altron Arrow Editor's Choice Opto-Electronics
As a pioneer in this field, Cree LED has been instrumental in shaping the LED landscape, driving innovation and performance in this sector.

Read more...