X-ray inspection system provides 2.0 megapixel imaging

25 July 2007 Test & Measurement

Dage has announced that its XiDAT XD7600NT digital X-ray inspection system is now equipped with a standard 2.0 megapixel imaging system.

The system's innovative look and manipulator design provide oblique angle viewing of up to 70° for any position and 360° around any point of the entire 458 mm x 407 mm inspection area, allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices.

The XD7600NT comes standard with the Dage NT250 x-ray tube with 250 nanometers sub-micron feature recognition and realtime digital inspection at 2.0 megapixel, viewed on a 24" flat panel LCD display with up to 9200 X magnification. The image quality and enhanced feature recognition of the NT250 tube, combined with the XiDAT 2.0 imaging system and its easy to use ImageWizard software, provide world class inspection quality.

The system can be equipped with a computerised tomography (CT) option providing 3D modelling and volumetric measurement of solder joints. It can be easily converted between 2D and 3D modes, making it a common platform for analysis of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.

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