Interconnection


Power module combines high current-carrying capability and flexible stacking heights

24 January 2007 Interconnection

Erni has expanded its power components portfolio with the introduction of new MicroSpeed Power Modules. This complementary range of Power Module connectors, with 2,0 mm contact pitch, fulfils the need for miniaturised and high reliability power systems, and offers a large number of options for mezzanine applications. One of its unique features is its high current-carrying capacity in comparison to its small size. Based on a special contact material, the connector system achieves up to 6-8 A at 20°C. Therefore, the system is ideally suited for use with small, high performance devices such as CPUs, drives, LCD panels, etc.

Providing a variety of height versions of the male (1, 2, 9 and 10 mm) and female (4, 6, 8 and 10 mm) connectors, the Power Module series enables stacking heights from 5 to 20 mm. Subsequently, almost every need for different PCB arrangements can be addressed. Another major advantage is the multiple-connector mating capability, which allows the mating of more than one connector pair at the same time.

The SMT connectors meet all the needs of fast automatic assembly machines. They are manufactured and 100% inline quality checked. The integrated 3-point double beam female contact ensures durable low-contact resistance over the whole lifecycle.

The Microspeed Power Modules use pins with SMT termination. For the shield metal sheet, two termination options are available: SMT for standard applications, and THR shield pins with high retention forces for harsh environments. In addition, maximum wipe length is guaranteed within the smallest board-to-board distance.

The connectors are equipped with polarised positioning pegs, and the connector plating is lead free. The MicroSpeed Power Modules are specified for -55 to


125°C.



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