MEMS microphones improve voice quality for mobile electronic devices
1 November 2006
Passive Components
Information from Messe München
Anyone who has tried to make a cellphone call at a train station or airport knows the problem: announcements over the PA system and the sound of incoming trains or planes make it nearly impossible for the person on the other end of the line to hear clearly what is being said.
The breakthrough with micro-electro-mechanical systems (MEMS) technology in electroacoustics, is eliminating misunderstandings: MEMS microphones can be precisely aimed at the voice source, and they filter out unwanted background noise - which is ideal for those who use PDAs with speech recognition, notebooks with IP-telephony, or digital cameras with audio recording capabilities.
Besides their excellent voice quality, MEMS microphones also have an edge over conventional electret condenser microphones (ECMs) because they require less space and they are not sensitive to the high temperatures that arise in PCB production. Last year, according to The Information Network, 5% of all the microphones sold were based on MEMS technology. By 2008, their market share will be 15%. The current global market volume of 130 million US dollars is expected to rise to 680 million US dollars by 2010 with an annual growth rate of 62%.
With its 'World of MEMS' forum, electronica 2006 is - within the framework of electronica MicroNanoWorld in Hall A2 - spotlighting the development of MEMS microphones and other applications for micro-electromechanical systems. Examples of such applications include 'micro pumps' for cooling computer chips, micro fuel cells, pressure measurement devices implanted in heart vessels, lab-on-chip 'mini laboratories' for rapid analysis of substances, and acceleration sensors for controlling airbags.
This comprehensive forum is covering all areas related to these small systems: MEMS sensor technology, RF MEMS, micro-opto electromechanical systems (MOEMS), bio MEMS, and nano-opto electromechanical systems (NEMS), as well as packaging.
At electronica 2006 from 14-17 November in Munich, the 'World of MEMS' forum within the framework of MicroNanoWorld (www.electronica.de/micronanoworld) in Hall A2, will show the big trends for tiny electronic systems.
Further reading:
3,75 GHz RF inductor
RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...
Upgraded power inductor series
iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...
Advanced high-voltage capacitors
RS South Africa
Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.
Read more...
Chip capacitors for high-voltage applications
RS South Africa
Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new
900 V types.
Read more...
Moulded inductors
Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.
Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.
Read more...
The future of on-board charging
Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.
Read more...
First 100 µF MLCC in 0603 packaging
RS South Africa
Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.
Read more...
printer friendly version