Power MOSFETs now available in high thermal efficiency compact package

18 October 2006 Power Electronics / Power Management News & events

STMicroelectronics' new power devices that are assembled in the metal topped PolarPAK package, offer superior thermal performance and increased power density for components used in high current power supplies. The new STK800 and STK850 are 20 A and 30 A power MOSFETs needing only the same 5 x 6 mm board area as a standard SO-8 package, and with an even lower profile of only 0,8 mm, as a result of both top and bottom heat dissipation paths.

ST has a licence agreement with Siliconix to use the PolarPAK technology. The package's leadframe and plastic encapsulation are similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing. Yet compared to the standard SO-8, the PolarPAK dissipates heat very efficiently so that it can handle twice the current within the same footprint.

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