6 September 2006Manufacturing / Production Technology, Hardware & Services
When electronic assemblies are reworked there should be no reduction in quality and reliability. This is why Martin has introduced new QFN Reballing Technology to allow desoldered and no longer useful QFN components (quad-flat-no-lead) to be used again.
This saves the user the investment costs of a dispenser, as the usual procedure in reworking QFNs involves the dispensing of solder paste.
Desoldered QFN components that have only a small amount of residual solder attached to their contacts pose an unacceptable risk when re-used without having been reballed. The forming of new solder joints that rely only on residual solder and flux does not satisfy current industry expectations. Martin offers an alternative that it says is cost effective, with corresponding templates and hot air mini ovens to reclaim otherwise useless scrap as fully-functional components.
Normally, solder paste has to be applied when reworking QFNs to fully restore functionality. This requires a suitable dispenser, which is beyond the budget available for many small companies. This reballing is a valuable alternative. According to Martin, reclaiming desoldered components is carried out easily and accurately and ensures reliable soldering results. This also applies to CSP and BGA components.
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