Altera has expanded its MAX II device family to address the growing portable applications market with new ultra-small packages and a new power-down capability. The MAX II EPM240, EPM570 and EPM1270 devices are now available in 100-pin and 256-pin 0,5 mm Micro FineLine BGA (MBGA) packages and 100-pin 1,0 mm FineLine BGA (FBGA) package. Using the new MBGA packages, designers can integrate 50% more user I/O and logic elements for a given board area, on average, than industry standard CPLD solutions, claims Altera. MAX II CPLDs also offer extremely lowest dynamic power and a power-down capability to conserve battery life. Designers can further reduce system cost by using the new packages and MAX II devices' differentiating features, it adds, which includes high logic density, an on-chip voltage regulator and an internal oscillator, to integrate discrete devices and minimise the number of power rails.
Webinar: Game-changing Matter standard EBV Electrolink
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Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
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DSP, Micros & Memory
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The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
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