Air reflow, no-clean solder paste
26 July 2006
Manufacturing / Production Technology, Hardware & Services
Specifically formulated to accommodate the higher processing temperatures required by the new Pb-Free alloy systems (Sn/Ag/Cu and Sn/Ag) favoured by the electronics industry, Indium's 5.1AT is an air reflow, no-clean solder paste.
According to the manufacturer, this product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigours of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superior wetting to Pb-Free metallisations and low voiding on CSPs with microvia-in-pad designs.
According to Indium, the Indium5.1AT has a very robust process window, which has achieved voiding in the sub-5% range over many different profiles. Also, it exhibits good response-to-pause.
Other key features include: ultra-low voiding in BGA/CSP components; ultra-low voiding at via-in-pad sites; and superior micro-BGA/CSP printability.
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