At the MTT International Microwave Symposium, Infineon Technologies announced the extension of its BAW (bulk acoustic wave) filter product portfolio for cellphones. The complementary pair of new duplexer filters, the NWX2015CR (passband: 2110-2170 MHz) and the NWX2015CT (passband: 1920-1980 MHz), are the first BAW filters produced using WLP (wafer-level packaging) technology, which reduces production cost and board space requirements in 3G mobile phones.
The NWX2015CR/T are designed to maximise receive sensitivity and power efficiency of PA-duplexer RF front-end modules. With insertion loss, stop-band attenuation and isolation being stable over the entire temperature range, and WLP permitting very cost-effective module integration, these BAW filters are a critical enabler for 3G UMTS handsets. WLP technology shields the bare die usually sold to customers, simplifying module integration and making costly hermetic encapsulation unnecessary.
"In the worldwide market for BAW filter technology we see Infineon clearly as number two," said Yoshiyasu Andoh, president of the Japanese market research company Navian. "We expect the duplexer market to grow from 300 million pieces in 2005 to a total demand of well over 900 million pieces in 2010."
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