The FCR resistors from Arcol use thick film technology on an alumina substrate. The design yields greater power densities, requiring substantially less board space than other radial packages.
Maximum voltage rating is 300 V a.c/500 V d.c. and resistance range is 1 Ω to 200 kΩ. Other key features: high power density; non-inductive; planar package; heat dissipated well above board level.
3,75 GHz RF inductor RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...Upgraded power inductor series iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...Advanced high-voltage capacitors RS South Africa
Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.
Read more...Moulded inductors Future Electronics
Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
Read more...New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.
Read more...Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.
Read more...The future of on-board charging Future Electronics
Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Read more...Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.
Read more...First 100 µF MLCC in 0603 packaging RS South Africa
Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.
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