0201 and 01005 component assembly challenges to be discussed in webcast

8 February 2006 News

Speedline Technologies experts will tackle issues involved in the 0201 and 01005 component assembly process in free, live webinars designed for OEM and CEM process engineers.

The continuing demand for smaller, lighter portable products has escalated the use of miniature components throughout the electronics industry. Two packages, currently being used for resistors and capacitors, are the 0201 and 01005 chip component packages. Assembling these components presents a number of challenges for an electronic manufacturing operation.

Speedline Technologies will host the free one-hour Internet seminars to explore these challenges on Thursday, 16 February, 2006. Two live sessions are available: the first at 2 am-3 am US EST, and the second at 11 am-12 pm US EST.

The webinars will consist of an educational presentation, discussion of new technologies and techniques, practical how-to advice, and a Q&A opportunity. Specific areas of discussion will include: printed circuit board pad design; solder paste printing; solder paste selection; component placement; reflow soldering; inspection; and questions and answers.

To register, go to www.speedlinetech.com/seminars

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