Aries Electronics has introduced a high pin count (over 1400 balls) version of its unique PinBall Socket, featuring a customised heatsink, designed for high-end graphics processors. The new PinBall Socket can be soldered directly to the existing footprint of a PCB, further increasing packaging density.
An aluminium heatsink provides effective thermal dissipation of excess heat generated by the high performance graphics processors for which the socket is designed. The versatile BGA/LGA socket provides 2 mm of clearance for end components, and can be used for 0,80 mm, 1,00 mm and 1,27 mm pitch packages up to 50 mm, in any footprint configuration and on any size board.
The new socket incorporates Aries' high reliability spring probe technology, with a spring force of 17 grams at 0,635 mm deflection. The spring is BeCu alloy, and the pins are gold-plated brass alloy. The socket insulator is Torlon or PEEK with stainless steel hardware. The socket can be furnished with either a 2-bolt (for 15 mm packages and smaller) or 4-bolt (for 16-50 mm packages) hold-down.
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