Electronics Technology


Multidiscrete modules save space

4 May 2005 Electronics Technology

Central Semiconductor has introduced a family of discrete semiconductor devices called multidiscrete modules (MDM). The first two devices in the family are the CMLM0405 and CMLM0605. The CMLM0405 combines an isolated 60 V, Low VCE(SAT) NPN Transistor and a 0,5 A, Low VF Schottky diode. The complementary CMLM0605 is an isolated 60 V, Low VCE(SAT) PNP Transistor and a 0,5 A, Low VF Schottky diode. The combination of these devices is highly suited for motor control and DC-DC circuit applications.

The MDM family represents Central's first effort to utilise the benefit of different semiconductor devices in the same package. Packaged in a PICOmini SOT-563 surface mount case, the CMLM0405 and CMLM0605 offer a low profile of under 0,6 mm and require 65% less circuit board space when compared to a combination of an SOT-523 transistor and an SOD-523 Schottky diode.

Other MDM devices in the SOT-563 package currently in development include: CMLM2205: 75 V, Low VCE(SAT) NPN Transistor and 0,5 A, Low VF Schottky Diode; CMLM0705: 60 V, Low VCE(SAT) PNP Transistor and 0,5 A, Low VF Schottky Diode; CMLM0205: N-channel DMOS FET and 0,5 A, Low VF Schottky Diode.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

140 W USB-C PD reference design
Altron Arrow Electronics Technology
The design has a wide input range of 90 to 264 V AC, 50-60 Hz, and supports an output voltage range of 5 to 28 V (USB-PD 3.1 specification).

Read more...
Nanometre-precision piezo actuators
RS South Africa Electronics Technology
TDK Corporation has announced two new piezo actuators that are characterised by a wide dynamic range, a high force-to-volume ratio, but with precision in the nanometre range.

Read more...
900 V GaN flyback switcher IC
MB Silicon Systems Power Electronics / Power Management
The new ICs from Power Integrations deliver up to 100 W, with better than 93% efficiency, eliminating the need for heat sinks, and streamlining design of space-challenged applications.

Read more...
Webinar: The evolving electrification of the power distribution system
Infineon Technologies Electronics Technology
New connected car functionality, along with the necessity to reduce the cost, weight and complexity associated with wire harnesses, has led to the transformation of the power distribution system in automotive engineering.

Read more...
Improved MnZn material for power conversion industry
Sivan Electronic Supplies Electronics Technology
Cosmo Ferrites Ltd, a leading manufacturer of soft ferrites, has launched an improved version of CF295 for the power conversion industry.

Read more...
Common mode filter for automotive Ethernet
Avnet Abacus Electronics Technology
TDK Corporation has announced the introduction of its new ACT1210E Series common mode filter for automotive Ethernet 10BASE-T1S.

Read more...
Energising the industrial edge
Electronics Technology
As if the drive to decarbonise energy as part of sustainability and climate change efforts was not enough, the recent rise in energy prices has brought into sharp contrast the need to re-examine how we generate, distribute, and consume electricity.

Read more...
Samsung begins chip production using 3 nm process technology
EBV Electrolink Electronics Technology
The optimised 3 nm process with GAA architecture achieves 45% lower power usage, 23% improved performance and 16% smaller surface area compared to 5 nm process.

Read more...
Panasonic releases its updated touch-sensitive knob
Altron Arrow Electronics Technology
Panasonic, in conjunction with Microchip, has launched an update to its existing Magic Knob, a capacitive knob ready for standard touch sensors for use in controlling automotive information displays.

Read more...
New automotive-qualified driver family
MB Silicon Systems Power Electronics / Power Management
Power Integrations announces the SCALE EV family of gate-driver boards for Infineon EconoDUAL modules targeting high-power automotive applications.

Read more...