Microchip is introducing 2 x 3 mm DFN (dual flat no leads) package options across its product line of I²C and Microwire serial EEPROMs. This provides an extremely small footprint and low profile for space-constrained applications such as portable devices and laptop computers. The company claims its new DFN-packaged 64-Kbit I2C and 16-Kbit Microwire serial EEPROMs now offer the highest-density serial EEPROMs in the smallest standard package available.
With a PCB footprint of just 6 square millimetres, the new DFN package is 80% smaller than an 8-lead SOIC package; 59% smaller than an 8-lead MSOP package; and 27% smaller than a 5-lead SOT-23 package. In addition, for applications requiring a very low profile, the DFN package is only 0,9 mm tall - between 20 and 40% lower than other standard packages.
The new DFN package is available for Microchip's 24xx series of I²C serial EEPROM products in densities from 128 bits to 64 Kbits, and for the 93xx series of Microwire serial EEPROMs in densities ranging from 1 Kbit to 16 Kbits. The DFN package is lead (Pb)-free, and compatible with both higher temperature lead-free reflow processes, and existing tin/lead (Sn/Pb) processes.
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