Microchip is introducing 2 x 3 mm DFN (dual flat no leads) package options across its product line of I²C and Microwire serial EEPROMs. This provides an extremely small footprint and low profile for space-constrained applications such as portable devices and laptop computers. The company claims its new DFN-packaged 64-Kbit I2C and 16-Kbit Microwire serial EEPROMs now offer the highest-density serial EEPROMs in the smallest standard package available.
With a PCB footprint of just 6 square millimetres, the new DFN package is 80% smaller than an 8-lead SOIC package; 59% smaller than an 8-lead MSOP package; and 27% smaller than a 5-lead SOT-23 package. In addition, for applications requiring a very low profile, the DFN package is only 0,9 mm tall - between 20 and 40% lower than other standard packages.
The new DFN package is available for Microchip's 24xx series of I²C serial EEPROM products in densities from 128 bits to 64 Kbits, and for the 93xx series of Microwire serial EEPROMs in densities ranging from 1 Kbit to 16 Kbits. The DFN package is lead (Pb)-free, and compatible with both higher temperature lead-free reflow processes, and existing tin/lead (Sn/Pb) processes.
Altron celebrates 60th birthday with a call to rebuild Johannesburg Altron Arrow
News
Altron is celebrating its 60th birthday by honouring Johannesburg’s heritage and encouraging business, government and civil society to come together and respond to our President’s call to rebuild Johannesburg.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Reference board for cardio monitoring Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STDES-ESP01 reference board from STMicroelectronics demonstrates the capability of the ST1VAFE6AX and ST1VAFE3BX biosensors to detect ECG and SCG signals.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Multicell battery monitoring Altron Arrow
Power Electronics / Power Management
The LTC6811 from Analog Devices is a multicell battery stack monitor that measures up to 12 series connected battery cells with a total measurement error of less than 1,2 mV.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
printer friendly version