Telecoms, Datacoms, Wireless, IoT


Basestation RF power amplifier biasing

3 November 2004 Telecoms, Datacoms, Wireless, IoT

Power amplifiers used in basestations require biasing for proper RF performance. This article explains the two classes of biasing that are prevalent in the RF industry, analyses their characteristics, and shows implementations with existing ICs.

The power device of choice for basestation amplifiers today is the lateral DMOS (LDMOS) MOSFET, and is used in this article to illustrate biasing techniques. However, as future generations of devices become available, such as GaN FETs, HFETs, or SiC devices, they too will benefit from the following implementations.

RF classes and biasing

LDMOS amplifiers used in RF circuits exhibit varying degrees of nonlinearity, depending on the DC-bias level upon which the input RF waveshape rides. That is, while maintaining a constant RF gating signal, the output current's (Iout) harmonic content varies as the DC bias at the gate of an LDMOS device (Figure 1) changes. The harmonic content of the LDMOS amplifier's current is important because, in the RF load, it creates power interference with the local bandwidth (in-band interference) or with adjacent bandwidths (out-of-band interference).

Figure 1. LDMOS device gating is shown with an uncontrolled DC bias
Figure 1. LDMOS device gating is shown with an uncontrolled DC bias

The best linearity occurs when the output current tracks the input voltage - a 360° conduction angle. Operating the MOSFET in this manner (ie, class-A operation) creates less distortion than when biasing it in any other way. From a power-dissipation perspective, however, class-A operation is least desirable because it consumes the most DC current.

At high RF power, given a nominal power-supply voltage of 28 V, the DC power dissipated in the amplifier is prohibitive. For this reason, RF engineers use class-AB biasing in the last stage of an amplifier chain, while they favour class-A operation in the preceding stages where power dissipation is smaller by orders of magnitude. In class-AB stages, the output current does not track the input voltage entirely, and thus the amplifier's conduction angle is lower than 360°.

Distortion of the RF signal in class AB is more significant than in class A. The spectrum of this distortion is wider and more densely populated than that of class A. However class-AB power dissipation is lower because the average current into the amplifier is lower. In short, the basis for choosing a given class of commercial RF amplifiers is a tradeoff between linearity and efficiency.

Biasing requirements and LDMOS behaviour

Biasing requires managing the DC content in the LDMOS current across temperature and supply variation. The ultimate objective is to ensure that the amplifier RF gain, as well as its distortion levels, varies within limits consistent with requirements. In this respect, proper biasing can assist linearisation techniques to minimise distortion.

The equation governing LDMOS's gain is Iout = K (Vgs - Vth)², where K is a constant reflecting gain due to electron mobility and Vth is the FET's threshold. Both K and Vth are temperature dependent. In Figure 2, LDMOS characteristics are shown across temperature. In class AB, designers tend to operate the bias to the left of the crossover region where the gain has a positive temperature coefficient. In class A, operation occurs to the right of the crossover region.

Figure 2. LDMOS characteristics are shown across temperature
Figure 2. LDMOS characteristics are shown across temperature

Controlling A and AB bias with the DS1847

Figure 3 shows a DS1847 dual, temperature-controlled variable resistor controlling the gate of an LDMOS amplifier. The DS1847's internal temperature sensor provides a temperature reading to its look-up tables. These look-up tables adjust the IC's two 256-position variable resistors so the amplifier's gate receives the proper bias voltage. The user programs the look-up tables to generate a constant LDMOS-amplifier output current. Refer to Figure 2 (or to manufacturer-specific data curves) for LDMOS characteristics. By using the two resistors to attenuate the reference voltage, a temperature-insensitive voltage is maintained.

Figure 3. DS1847 dual, temperature-controlled variable resistor controls the gate of an LDMOS amplifier
Figure 3. DS1847 dual, temperature-controlled variable resistor controls the gate of an LDMOS amplifier



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

SMT-mountable card connectors
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik introduces four new SMT-mountable Nano SIM and microSD card connectors and expands its range with solutions for the smallest packages.

Read more...
Module for smart city and smart utility devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.

Read more...
Ultra-low-power wireless module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The STM32WBA5MMG from STMicroelectronics is an ultra-low-power, small form factor, certified 2,4 GHz wireless module that supports Bluetooth LE, Zigbee 3.0, OpenThread, and IEEE 802.15.4 proprietary protocols.

Read more...
Quectel partners with GEODNET
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.

Read more...
Bringing Bluetooth Channel Sounding to automotive and beyond with KW47
Altron Arrow Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.

Read more...
Dual-band GNSS antenna
RF Design Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.

Read more...
What is Wi-Fi HaLow and why choose it for IoT?
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.

Read more...
Wi-Fi 6 and Bluetooth LE coprocessor module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.

Read more...
Futureproofing IoT connectivity
SIMcontrol Telecoms, Datacoms, Wireless, IoT
A managed private APN assigns every device to an isolated carrier slice, producing a single ingress to the enterprise network, with traffic bypassing shared internet paths and reducing exposure.

Read more...
Extra slim 2,4 GHz radio module
Telecoms, Datacoms, Wireless, IoT
The Thyone I radio module from Würth Elektronik now has a little sibling: Thyone-e, which takes up 30% less space and represents a cost-effective alternative for applications in which the long-range mode is not required.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved