Passive Components


Tantalum vs Tanceram?

30 June 2004 Passive Components

Historically, Tantalum capacitors have been used for smoothing and decoupling etc. For high frequency applications, the Tanceram chip capacitor is an excellent substitute for a Tantalum capacitor.

Compared to a Tantalum, a Tanceram chip capacitor has a low ESR and low ESL at high frequencies. As a result, selecting a Tanceram capacitor with ½ to 1/10th the capacitance of a Tantalum will produce an impedance that is more than an order of magnitude lower than the Tantalum capacitor over the same high frequency range.

A typical 4,7 µF Tanceram chip capacitor has low impedance from 100 kHz to 70 MHz. The self-resonant frequency is approximately 3 MHz, which is a remarkably low ESL of 600 pH. Also, the lower impedance produces less heat in power conversion applications.

Often, simply substituting a Tanceram chip capacitor to replace a Tantalum capacitor will reduce the circuit size and cost while providing superior performance. A comparison/substitution chart can be e-mailed by TempeTech. It was developed based on the principles discussed above.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
Upgraded power inductor series
iCorp Technologies Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.

Read more...
Advanced high-voltage capacitors
RS South Africa Passive Components
These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.

Read more...
Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
The future of on-board charging
Future Electronics Passive Components
Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.

Read more...
Cooling on a chip
Passive Components
This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.

Read more...
First 100 µF MLCC in 0603 packaging
RS South Africa Passive Components
Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.

Read more...