Renesas Technology has developed a 5-layer stacked SiP (system in package) that incorporates a SuperH microprocessor, logic LSI chip and memory chips in a single package.
Increasing the current maximum number of stacked chips in a SiP from three to five, Renesas says it offers users a wider choice of chip combinations while enabling the mounting area to be reduced by approximately 70 to 80%. The device is suited for digital consumer products, such as digital video and still cameras, PDAs and mobile phones.
The 5-layer stacked SiP enables greater flexibility in creating a suitable configuration for a particular system. The stack structure enables the mounting area to be reduced compared with the use of individual packages. The device can also reduce system development times; using existing chips, the SiP can be developed in approximately five to six weeks from final specification to sample delivery, claims the company. The SiP also offers lower EMI noise and therefore more stable high-speed operation due to the reduced wiring length between chips.
Renesas currently mass-produces flat-type SiPs and 2-layer/3-layer stacked SiPs incorporating microcomputer chips such as a SuperH microprocessor, M16C or M32C microcontroller, and memory, such as synchronous DRAM or flash memory, in a single package. It is pursuing the development of SiPs as part of its SIP (solution integrated product) offering to users.
Altron celebrates 60th birthday with a call to rebuild Johannesburg Altron Arrow
News
Altron is celebrating its 60th birthday by honouring Johannesburg’s heritage and encouraging business, government and civil society to come together and respond to our President’s call to rebuild Johannesburg.
Read more...Reference board for cardio monitoring Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STDES-ESP01 reference board from STMicroelectronics demonstrates the capability of the ST1VAFE6AX and ST1VAFE3BX biosensors to detect ECG and SCG signals.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Multicell battery monitoring Altron Arrow
Power Electronics / Power Management
The LTC6811 from Analog Devices is a multicell battery stack monitor that measures up to 12 series connected battery cells with a total measurement error of less than 1,2 mV.
Read more...Innovative satellite navigation receiver Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released an innovative satellite navigation receiver to democratise precise positioning for automotive and industrial applications.
Read more...LED driver for industrial power supply indication Altron Arrow
Editor's Choice Circuit & System Protection
A simple and small solution for driving an LED to provide visual feedback in the presence/absence of a system’s power using a chip not originally designed for this purpose.
Read more...High-voltage step-down DC-DC converter Altron Arrow
Power Electronics / Power Management
The MAX17793 is a high-efficiency, high-voltage, synchronous step-down DC-DC converter with integrated MOSFETs operating over an input voltage range of 3 to 80 V.
Read more...High-speed SAR ADC simplifies design Altron Arrow
Analogue, Mixed Signal, LSI
The ADI AD4080 simplifies data converter integration by integrating a low drift reference buffer, low dropout regulators and a 16K result data FIFO buffer.
Read more...Ultra-low power Bluetooth connectivity Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Silicon Labs’ delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.
printer friendly version