DSP, Micros & Memory


High density SRAMs for multiple market applications

7 April 2004 DSP, Micros & Memory

Alliance Semiconductor has released a 36-megabit (36 Mb) synchronous SRAM family manufactured using state-of-the-art 0,13 µm copper process technology. According to Alliance these SRAMs provide higher densities, lower access latency, and lower power consumption to increase system performance in a variety of applications and end markets including storage systems, wireless infrastructure and networking.

The 36 Mb device configurations include 1 Mbx32, 1 Mbx36, and 2 Mbx18 operating at either 3,3 V or 2,5 V. The devices are user configurable to operate in either pipelined mode or in flow-through mode. In pipelined mode, the devices operate with clock rates up to 250 MHz and with clock access time less than 2,6 ns. In flow-through mode the clock access time is less than 6,0 ns. Both pipelined mode and flow-through mode offer active current of 450 mA and standby currents of 100 mA.

These SRAM devices support fast clock speeds with no turnaround delay (NTD) or synchronous burst interfaces. In addition, Alliance offers both the 100-lead TQFP and the space saving 165-ball BGA industry standard packaging options. They are available in 166, 200 and 250 MHz.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Artificial intelligence meets embedded development
Avnet Silica DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

Read more...
Embedded module for AI vision applications
Rugged Interconnect Technologies DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

Read more...
High-speed Flash for SoC applications
NuVision Electronics DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

Read more...
Super-fast H.264 encoder FPGA core
EBV Electrolink DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Read more...
ST MCUs extend ultra-low power innovation
Altron Arrow DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

Read more...
Chipset enables ultra-wide signal capture
RFiber Solutions DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
SoC for real-time AI at the edge
Future Electronics DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

Read more...
Evaluation kit for ML applications
Future Electronics DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

Read more...
Microprocessors with advanced graphics and connectivity
Avnet Silica DSP, Micros & Memory
Microchip’s SAMA7D65 MPU runs a 1 GHz Arm Cortex-A7 core and integrates MIPI DSI, LVDS display interfaces and 2D GPU for HMI applications.

Read more...